Printed Circuit Board Assembly

Description

FCC GROUP performs PCB project management, design, documentation, and artwork generation by using the latest software technologies to produce the highest quality products. Our Program Managers and Engineers are experts in CAD Star, Allegro, PADS, PCBA layout.

Our engineers can perform board layout from the customer’s schematic and will perform a Design For Manufacturing (DFM), Design For Test (DFT), and cost reduction review. We can also modify any existing drawing to customer specification.

All FCC GROUP facilities maintain high quality ISO 9000 standards. This commitment to quality means our customers receive the highest quality products worldwide.

We have experience in many methods of printed circuit board assembly, from thru-hole and mixed technology to customized fine pitch surface mount technologies. FCC GROUP ‘ complete breadth of manufacturing services and in-house testing capabilities keep product costs down, ensure product security and meet time to market requirements.

Electronic Manufacturing Services:

• PCBA layout
• Prototype builds
• Pre-production assistance
• Design For Manufacturing (DFM)
• Design For Test (DFT)
• proj manage
• PCBA Technologies
• BGA, Micro BGA
• Flip Chip, Chip On Board (COB)
• Tape Automated Bonding (TAB)
• Bare die wire bond
• PCMCIA
• Flying probe
• Selective Solder
• Surface Mount Capabilities
• PCBA for a wide range of volume, mix and complexity requirements
• No clean or aqueous solder process
• Fine pitch screen printing/placement down to 8 mil (.008″)
• Odd form part placement
• Mixed technology
• Mil-Spec
• 01005 and 0201 Chip Components
• MELFs
• Thru-Hole Capabilities

• No-Clean
• Water wash
• Ionic contamination testing
• Axial Insertion
• DIP Insertion
• Component Lead Forming
• In-Circuit Test Capabilities

PCBA Technologies

• X-Ray
• Automated Optical Inspection (AOI)
• In-circuit Test (ICT)
• Functional Certification Test (FCT)
• Assembly & Test Equipment

• Screen Printers: MPM & DEK
• Solder Paste Inspection (AOI): CyberOptic SE500
• Leading-edge X-Ray 3-D solder paste inspection
• Surface Mount Lines: Universal & FUJI High-speed placement,
• MYDATA low volume/high mix
• Fine Pitch/Odd Form Placement: Universal AdVantis
• Force Convection Reflow: Heller and BTU (Nitrogen)
• Fine Pitch/BGA Re-work: Conceptronics Freedom 3000
• Thru-Hole Lines: Universal and Dynaport Axial & Radial Inserters,
• DIP Inserters
• Wave Solder Machines: Electrovert, Econopak & Ultra 2000 (Nitrogen)
• Selective Soldering: Vitronic-Soltek my Selective
• X-Ray Inspection System: Nicolet 3D X-Ray
• In-circuit Test: Agilent Series 3, Genrad
• Automated Optical Inspection: YES Tech YTV-F1S
• Product specific functional tests