Custom built printed circuit board containing solid state switch sensing, driving electronics and keytop illumination.
Microprocessor based electronics offers a two-way interface, output formatting commands, and non-volatile memory to store operational data for later retrieval and analysis.
Machined and painted aluminum bezel.
Molded silicon rubber boot to actuate solid state switches and provides a water proof, dust proof seal with back lighted legends.
Bolt on, plug-in user interface control panel.
High Reliability Aerospace and Military Keyboards

Design & Development Services

HUMAN-MACHINE INTERFACE DESIGN AND DEVELOPMENT

FCC GROUP Engineered Technologies offers complete engineering support for all our HMI solutions. Our Engineering Team provides full design and development of any human-machine interface product from User Interface (UI) design, screen specification, and HMI software.
Our HMI Capabilities Include:

• Mechanical and Electrical Design
• LCD/Touch Screen Integration
• High Tech Light Guide Films
• Interface(HMI) Software and Firmware Development
• Electronic Human Machine Control Panel
• Mechanical and Electrical Design
• Our in-house engineering teams will work directly with you to solve any design challenges you may face.
• High Tech Light Guide Films

Using a thin back lighting panel enables clean and isolated visual feedback without adding cost. Back lighting panels can drive lower cost while still providing high durability and easy assembly. Alternate color or icon lighting provides visual verification of the selection and switch operation. It provides a visual cue and operation feedback in packages that are rugged, cleanable, and weatherproof.

Interface Software and Firmware Development
Part of the function of a human-machine interface is to communicate operating conditions of the device to trigger an alert or a response from the operator. Not only are we capable of designing and building hardware but we can design and incorporate operating software into the interface.
Software and Firmware Examples:

User Menu Displays. Everything from start-up/shut down menus, operating instructions or graphical interface commands.

Managing device inputs to trigger events. Including:

• Serial Input/Output Interface
• Bluetooth and Wireless Communications
• SD Card and USB Communication
• Pressure/Flow Switches
• TDS Meters
• Pressure Transducers
• Temperature Sensors
• Voltage/Current Sensors
• Battery Status
• Temperature/Humidity Sensors
• Valves and Mechanical Switches

Data logging/Storage – Being able to store historical data within the device in order to retrieve at a later date for warranty or repair purposes.

Customize the software and displays to provide up to 24 different languages on the display with only one model number. The user can select the language upon startup.

Managing firmware updates over time to keep your devices current with new technology.

The experience we’ve had with different Micro Controller platforms allows us to design and customize the most cost effective solutions for all your needs.

SMART HUMAN-MACHINE INTERFACES

Several new technologies are changing how companies think, design, and integrate user interface controls into their devices. These new technologies along with the continued push towards all devices being connected using internet of things (IoT) technologies will take operational efficiency, performance and productivity to a level not yet achieved and not imagined a decade ago. They will now provide almost unlimited control, monitoring, and visibility, giving users and manufacturers more data, and more analytic power to improve actionable decision making. Many of these technologies have existed for years, but now thanks in part to advancements in wireless capabilities and cost of manufacturing, among other things, they are now taking hold in industrial, medical, and commercial applications.
SMART Human-Machine Interface for Medical Device

Definition of Traditional HMI’s

The SMART Human-Machine Interface (HMI) is the part of the machine that handles human interaction. The SMART HMI in a device is the user interface that provides control, monitoring, and visualization between a human and a device. This Includes taking inputs from sensors inside the device to trigger action.

Different Platforms & Types of HMI’s

The definition of HMI’s, Panel PCs and User Interfaces in general have changed over the last decade, however there are a few distinct differences.

The post User Interfaces appeared first on PCB Manufacturing Service - PCB Manufacturer China - Pcba.

For RF products, our technical expertise in RF design allows for us to fulfill all stages of product development from circuit design to a turn-key solution. With over sixty years of experience and knowledge across diverse industries, we have the ability to think outside the box and create innovative designs and solid manufacturing solutions.

Printed circuit boards are in our blood, which gives us a significant competitive advantage when creating custom designs as we can move from design to first prototype PCB within 48-hours.

Custom Designed RF Product Custom Engineered RF Product
The process starts with our RF design team in finding creative solutions to determine the best technology to fit your required specifications. In all cases we provide RF DFM (Design for Manufacturability) at low and high volume, design engineering for test fixtures, test software, and all phases of RF Manufacturing.

Electrical Engineering

Using the latest in electrical design software (Keysight Genesys and AWR Microwave Office) we can provide all of the following and much more.

Designing microstrip circuits, along with impedance matching.
Microstrip filters, hybrids, directional couplers, diplexers, etc.
RF lineup analysis, including transmit upconverters, receive downconverters, cascaded noise figure, gain, and IP3 calculations.
2.5 or 3D simulation, such as HFSS, Axiem (AWR), or Momentum.
Knowledge of digital communication schemes such as BPSK, QPSK, GMSK, PCM/FM, etc.

Mechanical Engineering

FCC GROUP’s experienced mechanical design team utilizes SolidWorks to help ensure the mechanical design is optimized to fit within the smallest possible footprints across the most demanding (size constrained) designs. Miniaturization, including in size, weight, and power is critical in many military applications and our team uses world class tools to meet even the strictest specification.

A lot of these RF designs will be subject to harsh environments. FCC GROUP’s mechanical design team will coordinate the specifics of a shock and vibration study in the design prior to hardware being design. They will also spearhead the RF shielding and thermal analysis components to ensure that our design meets whatever combination of specifications that we are faced with.

All of these tools allow us to transform a customer’s concept into a production ready, cost effective end product that is delivered quickly and of high reliably.

RF MANUFACTURING CAPABILITIES

RF Product Manufacturing RF Product Assembly

Our lean manufacturing and assembly lines which allows FCC GROUP to have wide variety of products in production at the same time. From special vision systems to automated test equipment, solder reflow and crystal tuning along with our own machine shop, this investment allows FCC GROUP to reduce cycle time and help our customers get to market faster.

Along with our substantial investment in equipment, production technicians follow all requirements in the corresponding work instructions including quality control procedures necessary to assure the product exceeds the stated requirements and guideline including IPC standards. Our paperless system assures that we are always using the most up to date documents and provides electronic tracking of operator processes.

Our clean rooms and a complete range of in-house RF and environmental testing capabilities support our high-reliability space and military projects.

INJECTION MOLDED PLASTICS

FCC GROUP is a custom manufacturer of injection molded plastic materials and thermoplastic molding used in a variety of applications within various markets and industries.
Injection Molded Plastics
At FCC GROUP we understand that the tooling cots is many times the barrier to getting a new project off the ground so we share the cost with our customers in order to demonstrate our willingness to move forward.

• Our Plastic Capabilities Include
• Over Molding
• Insert and Multi-shot Injection Molding
• Designing
• Assembly
• Heat Staking
• Hot Stamping
• Pad Printing
• Ultrasonic Welding
• Bar Coding
• Various Plastic Materials Include
• Nylon
• ABS
• PP
• PE
• PPO
• Polyester
• PC and Acrylic

The post RF PRODUCT DESIGN & ENGINEERING SERVICES appeared first on PCB Manufacturing Service - PCB Manufacturer China - Pcba.

Our engineers can perform board layout from the customer’s schematic and will perform a Design For Manufacturing (DFM), Design For Test (DFT), and cost reduction review. We can also modify any existing drawing to customer specification.

All FCC GROUP facilities maintain high quality ISO 9000 standards. This commitment to quality means our customers receive the highest quality products worldwide.

We have experience in many methods of printed circuit board assembly, from thru-hole and mixed technology to customized fine pitch surface mount technologies. FCC GROUP ‘ complete breadth of manufacturing services and in-house testing capabilities keep product costs down, ensure product security and meet time to market requirements.

Electronic Manufacturing Services:

• PCBA layout
• Prototype builds
• Pre-production assistance
• Design For Manufacturing (DFM)
• Design For Test (DFT)
• proj manage
• PCBA Technologies
• BGA, Micro BGA
• Flip Chip, Chip On Board (COB)
• Tape Automated Bonding (TAB)
• Bare die wire bond
• PCMCIA
• Flying probe
• Selective Solder
• Surface Mount Capabilities
• PCBA for a wide range of volume, mix and complexity requirements
• No clean or aqueous solder process
• Fine pitch screen printing/placement down to 8 mil (.008″)
• Odd form part placement
• Mixed technology
• Mil-Spec
• 01005 and 0201 Chip Components
• MELFs
• Thru-Hole Capabilities

• No-Clean
• Water wash
• Ionic contamination testing
• Axial Insertion
• DIP Insertion
• Component Lead Forming
• In-Circuit Test Capabilities

PCBA Technologies

• X-Ray
• Automated Optical Inspection (AOI)
• In-circuit Test (ICT)
• Functional Certification Test (FCT)
• Assembly & Test Equipment

• Screen Printers: MPM & DEK
• Solder Paste Inspection (AOI): CyberOptic SE500
• Leading-edge X-Ray 3-D solder paste inspection
• Surface Mount Lines: Universal & FUJI High-speed placement,
• MYDATA low volume/high mix
• Fine Pitch/Odd Form Placement: Universal AdVantis
• Force Convection Reflow: Heller and BTU (Nitrogen)
• Fine Pitch/BGA Re-work: Conceptronics Freedom 3000
• Thru-Hole Lines: Universal and Dynaport Axial & Radial Inserters,
• DIP Inserters
• Wave Solder Machines: Electrovert, Econopak & Ultra 2000 (Nitrogen)
• Selective Soldering: Vitronic-Soltek my Selective
• X-Ray Inspection System: Nicolet 3D X-Ray
• In-circuit Test: Agilent Series 3, Genrad
• Automated Optical Inspection: YES Tech YTV-F1S
• Product specific functional tests

The post Printed Circuit Board Assembly appeared first on PCB Manufacturing Service - PCB Manufacturer China - Pcba.

Below you will find the minimum data information requirements needed to place your flex or rigid-flex circuit board order. The purpose of this webpage is to describe the minimum data and information required to generate the tooling for your order.
The minimum required data and information set can be broken down into the two categories: Data Requirements and Fabrication Instructions.

|

Flex & Rigid-Flex Data Requirements

Date set consists of the traditional data package which must include the following:

Gerber Data in the following formats:

• Gerber files with aperture lists
• DXF can be used requires an approval prior to production
• ODB++ format

See our blog post on rigid-flex PCB gerber layout requirements for more information.

Drill Data in the following formats:

• Excellon 1
• Excellon 2

Also acceptable is ODB++ data. ODB++ will be supplied as a single file, usually with the extension of .tgz. ODB++ contains all the required board and drill information.
* Note: Any other data formats need to be reviewed and approved by Epec Engineering before the order can be placed.
Flex & Rigid-Flex Fabrication Instructions
The fabrication instructions should contain all relevant information required to tool and build the part including:

• Material Stackup: Defining all materials, copper weights, Coverlay/Soldermask(s), and finished thickness requirements with tolerance(s)
• IPC 6013 Manufacturing Class 2 or 3 (Class 1 not available)
• Hole sizes with tolerances, and plating information
• Board outline detail with all required dimensions and tolerances
• Hole or feature to edge dimensions
• Surface finish requirements
• Silkscreen requirements
• Min. Bend Radius requirement(s)
• ZIF Connector make(s) & part number(s) that the design connects to (if utilized)
• Technical contact information
• Any additional requirements (i.e. impedance control, plugged vias, stiffeners, PSA etc.)

Fabrication instructions may be supplied in the following formats:
Fabrication Drawing formats:

• Adobe Acrobat (.pdf)
• Gerber
• RS274X
• HPGL
• AutoCAD (.DWG or .DXF)
• Graphic file (.JPG, .GIF, .TIF, etc.)
• ODB++
• Array configurations – tab or scored preference

Notes, read me files, and/or customer specification

FLEX CIRCUIT TERMINATION METHODS

There are a variety of terminations for flex circuits and we can provide all of these as standard manufacturing process. Adding connectors and other minor component assembly is a common practice when producing a flex circuit. List below are some of the common termination methods used in flex circuit technologies.
ZIF Connectors
A ZIF (zero insertion force) is a type of connector that requires very little force for insertion. They allow for top and bottom contact options, vertical and right angle orientations, surface mount and through hole terminations.
Contact spacing options are allowed down to 0.2mm pitch. Using a ZIF connector eliminates the need for a mating connector. The flex circuit end “mates” into the connector usually located on the rigid board. The ZIF contacts also allow for repeated cycling with minimal wear.

Thru-Hole Connectors or Surface Mount Connectors
Thru-hole or surface mount are the traditionally technology that are used in today’s printed circuit boards. Right angle, Co-Planar, Parallel, and many others options are available.

Crimped Contacts & Displacement Connectors

• Contacts are crimped through the dielectric material into the copper conductor.
• Contacts are available for .100″ (2.54mm) or .050″ (1.27mm).
• Centerline housings can also be added to encapsulate the contact.

FLEX & RIGID-FLEX CIRCUIT BENEFITS

Flex and Rigid-Flex circuits gives the ability to design your circuitry to fit the device, instead of building a device to fit the circuit board. They are designed for the rigors of aerospace, medical and military applications, with dependable reliability.
Flex circuits offer multiple advantages for anyone considering to use this technology in a future project or if you’re trying to decide on re-engineering your current design. Below you will find some key benefits of using flex and rigid-flex circuit technology.
For more information see our blog post on Why You Should Use Flex Circuits.
Package Size & Weight Reduction
Combination of design freedom, space, weight and component savings can reduce packaging requirements significantly when using flex circuits as compared to other solutions.

• Flexible circuit boards fit where no other solutions can.
• Flexible circuit boards are thin and light weight which enables a substantial packaging size reduction.
• They have the ability to be folded or creased and positioned into the smallest areas makes miniaturization of many devices possible.
• Space requirements can be minimized by applying the freedom of 3D packaging geometry.
• Utilizing a flex circuit solution into your design can offer a substantial weight reduction benefit over using wires and wire harnesses.
• Flexible circuits can be used to replace wiring reduces the errors common in hand wired assemblies.

Reliability & Durability

• Increased reliability by eliminating interface connections (solder joints, connectors, contact crimps etc.).
• The fewer number of interconnects, the fewer the sources of potential failure.
• Rigid-Flex technology which integrates both a flex circuit and a rigid PCB further reduces the number of interconnects.
• Flex circuit’s ductility and low mass will reduce the impact of vibration and shock and improve performance.
• The exceptional thermal stability of polyimide allows the circuit to withstand applications with extreme heat, as the materials excellent thermal stability provides a better base for surface mounting than traditional boards. Because the compliant base film places less stress on soldered joints, thermal mismatch is less likely to occur.
• Used extensively in high reliability military and medical applications.

Cost Savings

• Thin and flexible polyimide film requires a much smaller area, reducing the overall finished assembly packaging size and material requirement costs.
• Reduced assembly costs are also seen as fewer parts are needed for the final assembled product.
• A simplified PCB assembly processes can reduce assembly errors as the flex circuit can only be installed one way.
• Flex circuits also eliminate wire routing errors; reducing test time, rework, and rejects.

High Temperature Applications

• Flex circuits materials (polyimide) dissipate heat at a better rate than other dielectric materials while providing the added benefits of vastly improved flexibility.
• Can be exposed to extreme temperature applications (up to – 200C to 400C).
• Expansion and contraction are minimized when using polyimide material.
• Good chemical resistance to oils, acids, gases etc.
• Flex circuits offer excellent radiation and UV exposure resistance.

High Density Applications

• Flex material properties work very well in high speed “Controlled Impedance” designs, which allow better control of impedances.
• Flexible circuits allow for narrow lines giving way to high density device population. Denser device populations and lighter conductors can be designed into a product, freeing space for additional product features.

Shielded Applications

• EMI and RF shielding is available.
• Multiple options including sliver ink, copper layers, and EMI shielding films.

Component / Connector Assembly

• Flex circuits can accept any component or connector that can be assembled to a rigid PCB design.
• Integrated ZIF contacts provide simple modular interfaces to the system environment.
• Additional options are available such as, ZIF Connectors, crimped contacts, direct solder to PCB, etc.

The post Flex & Rigid-Flex appeared first on PCB Manufacturing Service - PCB Manufacturer China - Pcba.

HDI boards, one of the fastest growing technologies in PCBs, are now available at FCC GROUP. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

Consumer Driven Technology

The via-in-pad process supports more technology on fewer layers, proving that bigger is not always better. Since the late 1980’s we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and working from home pushed technology further to make computers faster and lighter, allowing the consumer to work remotely from anywhere.
HDI Technology is the leading reason for these transformations. Products do more, weigh less and are physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed.

Key HDI Benefits

As consumer demands change, so must technology. By using HDI technology, designers now have the option to place more components on both sides of the raw PCB. Multiple via processes, including via in pad and blind via technology, allow designers more PCB real estate to place components that are smaller even closer together. Decreased component size and pitch allow for more I/O in smaller geometries. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

Cost Effective HDI

While some consumer products shrink down in size, quality remains the most important factor for the consumer second to price. Using HDI technology during design, it is possible to reduce an 8 layer through-hole PCB to a 4 layer HDI microvia technology packed PCB. The wiring capabilities of a well-designed HDI 4 layer PCB can achieve the same or better functions as that of a standard 8 layer PCB.
Although the microvia process increases the cost of the HDI PCB, the proper design and reduction in layer count reduces cost in material square inches and layer count more significantly.

Building Non-Conventional HDI Boards

Successful manufacturing of HDI PCBs requires special equipment and processes such as laser drills, plugging, laser direct imaging and sequential lamination cycles. HDI boards have thinner lines, tighter spacing and tighter annular ring, and use thinner specialty materials. In order to successfully produce this type of board, it requires additional time and a significant investment in manufacturing processes and equipment.

Laser Drill Technology

Drilling the smallest of micro-vias allows for more technology on the board’s surface. Using a beam of light 20 microns (1 Mil) in diameter, this high influence beam can cut through metal and glass creating the tiny via hole. New products exist such as uniform glass materials that are a low loss laminate and low dielectric constant. These materials have higher heat resistance for lead free assembly and allow for the smaller holes to be used.

Lamination & Materials For HDI Boards

Advanced multilayer technology allows for designers to sequentially add additional pairs of layers to form a multilayer PCB. The use of a laser drill to produce holes in the internal layers allows for plating, imaging and etching prior to pressing. This added process is known as sequential build up. SBU fabrication uses solid filled vias allowing for better thermal management, a stronger inter connect and increasing the board’s reliability.

EXTREME COPPER PRINTED CIRCUIT BOARDS

The special requirements for the design of heavy copper printed circuit boards, EXTREME copper printed circuit boards and PowerLink technology and other forms of component mounting and interconnecting structures incorporating copper weights ≥ 3oz/ft2. Some sections of this standard are guidelines ONLY, and are noted as such.

The requirements contained in this standard are intended to establish design recommendations that are to be used in conjunction with the design principles laid out in IPC-2221, IPC-2222.
This standard’s intended use is by printed circuit board designers who incorporate copper weights ≥ 3oz/ft2 into their products.

General Design Considerations

The general parameters to be considered before and during the design of any printed circuit board, but focuses on boards incorporating copper weights ≥ 3oz/ft2. The following parameters can and will have a major impact on reliability and performance of the end product. FCC GROUP believes the parameters listed in this section are a MINIMUM to be considered. A comprehensive listing of all parameters and their design/performance tradeoffs is shown in IPC-2221.

End-Product Requirements
The end product requirements must be known before design start-up. Servicing and maintenance of the end product can directly influence conductor routing, part placement, board size, markings, coatings and final finish.

Microwave & RF Circuit Boards

MICROWAVE & RF PRINTED CIRCUIT BOARDS

In order to meet increasing demands for Microwave & RF Printed Circuit Boards for our customers all around the world, we have increased our investment over the last few years so that we have become a world class manufacturer of PCB’s using high frequency laminates.
These applications typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristics that exceed those of traditional standard FR-4 materials. With our many years of experience with PTFE-based microwave laminate, we understand the high reliability and tight tolerance requirements of most applications.

Our experience allows us to provide our customers with most comprehensive service in circuit board production for these products as we have invested in.

PCB Material Stock

Will all the different features of every RF PCB application, we have developed partnerships with the key material suppliers such as Rogers, Arlon, Nelco, and Taconic just to name a few. While many of the materials are very specialized, we do hold significant stock of product in our warehouse from Rogers (4003 & 4350 series) and Arlon. Not many companies are prepared to do that given the high cost of carrying inventory to be able to respond quickly.
High technology circuit boards fabricated with high frequency laminates can be difficult to design because of the sensitivity of the signals and the challenges with managing the thermal heat transfer in your application. The best high-frequency PCB materials have low thermal conductivity versus the standard FR-4 material used in standard PCBs.
RF and microwave signals are very sensitive to noise and have much tighter impedance tolerances than traditional digital circuit boards. By utilizing ground plans and using a generous bend radius on impedance controlled traces can help make the design perform in the most efficient manner.
Because wavelength of a circuit is frequency dependent and material dependent, PCB materials with higher dielectric constant (Dk) values can result in smaller PCBs as miniaturize circuit designs can be used for specific impedance and frequency ranges. Oftentimes high-Dk laminates (Dk of 6 or higher) are combined with lower cost FR-4 materials to create hybrid multilayer designs.
Understanding the coefficient of thermal expansion (CTE), dielectric constant, thermal coefficient, temperature coefficient of dielectric constant (TCDk), dissipation factor (Df) and even items like relative permittivity, and loss tangent of the PCB materials available will help the RF PCB designer create a robust design that will exceed the required expectations.

Specialized Processing Equipment

Much of the processing for Microwave/RF PCB’s can be done on standard fabrication equipment. However, the need for specialized equipment is requires for the most demanding designs. We have in house Plasma Etch equipment to ensure that the quality of the thru holes is at the highest level. Along with that we use Laser Direct Imaging (LDI) equipment versus the more traditional photo exposure tools so that we can hold very tight trace widths and front to back registration requirements.

Wide Ranging Capabilities

In addition to standard Microwave/RF PCB’s :

• Hybrid or Mixed Dielectric Boards (PTFE/FR-4 combinations)
• Metal Backed and Metal Core PCB’s
• Cavity Boards (Mechanical and Laser Drilled)
• Edge Plating
• Constellations
• Large Format PCB’s
• Blind/Buried and Laser Via’s
• Soft Gold and ENEPIG Plating

The post Circuit Boards appeared first on PCB Manufacturing Service - PCB Manufacturer China - Pcba.

FCC GROUP can build to print most custom overmolded cable assemblies designed for today’s sophisticated applications. Overmolded cable assemblies that can withstand harsh or demanding environments or have performance parameters that must be met for your industry, we have the engineering, design, and technology resources to take a cable assembly concept and transform it into a solution that can be manufactured to meet the demands of your application.
Over Molded Cable AssembliesCustom Overmolded Cable Assemblies
From extreme environmental stresses to the strains of abrasion and high-repetition movement, molded cable assemblies must be built to last. After choosing the right materials (PVC, rubber, santoprene, ABS, Polycarbonate (PC), Macromelt and many others) we identify the best production processes. Each stage of premolding, potting and overmolding is reviewed. We provide the right mix of waterproofing and abrasion resistance, meeting IP67 and IP68 standards if necessary. Soldering and crimp joints are examined, and premolding, overmolding or both can be incorporated to secure the connections and provide strain relief, durability and a long, useful life. We can design custom potting fixtures machined in specific shapes, adding coatings to the potting fixtures to ensure a good release and a clean finish.

Military Wire Harnesses

Military Wire Harness Capabilities

FCC GROUP’s capabilities include cable and harness fabrication, design, high voltage isolation testing, as well as continuity and capacitance testing. We also have over 20 years of environmental test experience on staff, Our experience gives us a unique understanding of the military specifications, lead times associated with many specialty components, and the documentation required to deliver quality product.

FCC GROUP can design custom cable assemblies from customer specifications and furnish our customers with a complete design and test package. Or assemblies can be fabricated from customer provided drawings.

MEDICAL DEVICE CABLES

Today’s medical device and life science instrument market requires cable manufacturers to produce technologically advanced medical cables that are built to exacting specifications.

Companies in this market must comply with stringent regulations, which are intended to ensure delivery of high quality products on a repeatable basis. FCC GROUP provides engineering and manufacturing services or interconnect solutions resulting in rapid development of cost-effective products, while adapting to fluctuating demand for medical device OEMs.

Our advanced solutions include ruggedized reusable assemblies, ergonomic/lightweight constructions and cost-optimized disposables that are designed to meet custom requirements for a variety of medical device markets. All of these services are provided in vertically integrated ISO 13485 and ISO 9001 certified and FDA compliant environment.

Cable Assembly for a Medical Device

Medical Cable Capabilities

• Cable design and manufacture
• Connector design and manufacture, or build to print
• Custom overmolding
• Non-magnetic connectors, cables and assemblies
• Disposable/Reusable cable designs
• Moisture proofing to IP standards
• Low noise shielding
• Resistance to steam, gamma, ETO and other sterilization methods
• High temperature insulators
• Hi-Flex and long-life cable designs
• Potting and pressure testing
• Chemical Resistance
• Serialization and lot control
• Statistical process control
• Medical-grade materials – including TPE, polyurethane and silicone
• EMI suppression

Medical Applications

• X-ray & Magnetic Resonance Imaging (MRI)
• Circulatory Assist Devices
• Electrosurgery Cables
• Defibrillators
• SpO2 Disposable and Reusable Cables
• Pulse Oximeters
• Patient Monitoring Equipment
• Medical Diagnostic Equipment
• Medical Imaging
• Ultrasound Probes
• Telemetry Ca

The post Cable Assemblies appeared first on PCB Manufacturing Service - PCB Manufacturer China - Pcba.